Advanced Packaging for Microelectronic and Microsystem Applications by Travis Anderson
Advanced Packaging for Microelectronic and Microsystem Applications

Travis Anderson

Advanced Packaging for Microelectronic and Microsystem Applications

Travis Anderson

116 pages missing pub info (editions)

nonfiction art technology
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The emergence of GaN-based devices promises a revolution in areas requiring high performance electronics, such as high speed earth and space-based communication systems, advanced radar, integrated sensors, high temperature electronics, and utility...

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